The power semiconductor module makes the high-power thyristor chip or rectifier chip as the core, and assembly two or more chips into module according to specific circuit structure to realize the rectification, voltage adjustment and switch function. The chip adopts the DBC ceramic chip, vacuum welding technique, program controlled hydraulic technique and international standard. The leading-out terminal and heat dissipation base are encapsulated by silica gel and epoxy resin, therefore featuring good electric insulation between them. The power semiconductor module features small size, high sensitivity, no electric arc, large load power and long lifespan.